FOR IMMEDIATE RELEASE
Panasonic’s New Process-flexible Flip Chip Bonder Garners Interest of NA High-Reliability Manufacturers at Semicon
Rolling Meadows, IL (July 29, 2014) – Panasonic Factory Solutions Company of America’s new process-flexible, flip chip bonder garnered the interest of North American high-reliability manufacturers—from photonics to high frequency devices—at Semicon West 2014.
According to Mr. Tae Yi, Panasonic Factory Solutions Global Accounts Manager and Microelectronics Equipment Specialist, “"We are experts in the thermosonic process for the SAW, TCXO, LED, and CMOS markets and already have many high-volume customers in Asia. Now, as affirmed at Semicon, this technology adoption and on-shoring is becoming a growing trend in North America. Because of our expertise, Panasonic can quickly help manufacturers in the Americas adopt thermosonic bonding and overcome process challenges.”
The company’s newest die bonder, the MDP-300, combines high accuracy C4 and C2 flip chip, thermosonic, and thermocompression processes into a single, small footprint bonder. Mr. Yi concluded: “Nearly all my conversations with customers over the three days of the show followed a continuous theme—process flexibility and high accuracy. Their interest increased when they learned that the MDP-300 can be in-line with a Panasonic SMT machine for a high-throughput, hybrid COB process solution."
The company also introduced the APX300 Plasma Dicer that can help customers solve critical yield challenges of singulation using Panasonic’s non-contact plasma technology. The platform is ideal for small, thin, and brittle dicing required by MEMS, Power, LED, and other markets.
About Panasonic Factory Solutions Company of
Panasonic Factory Solutions Company of
Kristin Serna (Media Relations) 847.637.9600 PFSAmarketing@us.panasonic.com